CNC Milling
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3Dnatives to Present ADDITIV Metals 2026: Resolving Key Barriers to Scaling Metal Additive Manufacturing
As the metal additive manufacturing sector prepares for a massive leap—with market valuations expected to climb from $6.02 billion...
AMPulse Asia: Creality IPO Headlines APAC 3D Printing Market Roundup
Asia’s additive manufacturing sector spent the back half of May moving capital and capacity, not just demos. Chinese desktop and c...
Industrial AI isn’t really about AI at all
AI is not the transformation; it’s the instrument revealing where transformation is needed. The post Industrial AI isn’t really ab...
Blue Origin’s New Glenn Explosion Comes During Major Manufacturing Push
Blue Origin‘s orbital New Glenn rocket exploded during a hot-fire test at Launch Complex 36 in Cape Canaveral on May 29, setting b...
NVIDIA unveils RTX Spark superchip for Windows PCs
It combines a Blackwell GPU, 20-core Grace CPU, 128GB unified memory and on-device agent security for AI workloads. The post NVIDI...
Stratasys and Markforged: ‘The perfect match’
Stratasys CEO Yoav Zeif discusses his company’s recent acquisition of Markforged. The post Stratasys and Markforged: ‘The perfect ...
ORNL Improves Error Mitigation in Large Polymer Parts
Oak Ridge National Laboratory (ORNL) has commercialized a number of large-format 3D printing technologies. Now, scientists are wor...
UAS Additive Strategies: Register by June 30 to Learn About the Hottest Topic in 3D Printing
Last week, drone stocks surged on news that the Trump administration is considering a massive investment in the US unmanned aerial...
Bambu Launches A2L: What the New Printer Reveals About Its Strategy
Bambu Lab continues its relentless march for 3D printing domination with the launch of the A2L. The 330 × 320 × 325 mm printer wil...
3D Printing Financials: XTPL Adds New Semiconductor and Defense Customers in Q1 2026
Polish microprinting company XTPL (WSE: XTP) reported first-quarter 2026 revenue of PLN 1.6 million (roughly $441,000) as the comp...
Cadence extends chip design agent to Level-5 autonomy
The software is designed to cut RTL validation from about five weeks to less than a day using automated simulation and formal flow...
Siemens and Samsung expand foundry design collaboration
The work covers PIC verification, 3D IC packaging, DFT, analog and RF validation and digital implementation at advanced nodes. The...