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View All →Siemens expands agentic AI for 3D IC design workflows
The workflow coordinates electrothermal analysis across seven EDA tools to evaluate hundreds of design points ...
How Siemens Designcenter is infusing cutting-edge technology into product development
Combining AI, cloud, immersive capabilities and industry processes to create and connect modern engineering wo...
NVIDIA introduces containerized reference design for AI factories
DSX POD integrates computing, networking and cooling before delivery, with deployment targeted in as little as...
Formlabs introduces Nylon 11 Pro Powder for Fuse SLS printers
Nylon 11 Pro Powder supports flexible, impact-resistant parts with fine features for prototypes, fixtures, ort...
Pentagon Turns to Nikon to Ramp Up Tomahawk Production
In a recent post, I argued that solid rocket motors (SRMs) are the first big scaling challenge for 3D printing...
PTC launches cloud-based product collaboration platform
PTC Jetstream links product reviews, feedback and decisions with Windchill data for traceable team collaborati...
The Two Paths to AM Print Services Market Growth
AM Research New market research: AM Research is building its new Additive Manufacturing Services Market 2.0 mo...
ABB and Mitsubishi Electric form low-voltage power joint venture
ABB will acquire a 51% stake for about $495 million, with closing expected in the second half of 2027, pending...
Schneider Electric, AVEVA, Nscale and Start Campus pilot AI digital twin
The OpenUSD-based model combines power, cooling and operational data to test infrastructure changes and reduce...
Rochester supports long-life Intel x86 processor systems
Inventory covers more than 280 part numbers and two million units, alongside legacy microcontrollers and speci...
Mouser stocks BrightSense 5.1 MP CMOS image sensors
STMicroelectronics sensors support RGB-NIR and monochrome imaging, with OBGA packages and bare die options for...
Formlabs Enters the $699 Resin 3D Printer Market, Taking on Chinese Competitors
Formlabs is moving into a very different part of the 3D printing market. The Massachusetts-based company, best...
AMAZEMET Signs MOU with F4E for Fusion Power Additive Manufacturing
AMAZEMET has signed a Memorandum of Understanding (MOU) with Fusion for Energy (F4E). F4E is perhaps not widel...
In conversation with the head of HP Additive Manufacturing
Alex Moñino talks about quality, education, and competition in 3D printing. The post In conversation with the ...
Amazon Takes on Another Industry: Robotics
The software and retailing giant is addressing their considerable demand for robotics in-house with a new auto...
AI that understands physics
Physics AI is a new technology that promises to transform science and engineering. It’s not the same as physic...
Socionext expands AI-based design across SoC development
The company is applying Cadence tools to a large-scale 3nm SoC and integrating internal engineering knowledge ...
Siemens tests AI manufacturing tools at Erlangen plant
The applications support PCB inspection preparation and production planning using digital twins, AI agents and...
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