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AIAA forms team to define CFD priorities through 2045
The group will assess aerospace simulation needs and develop a roadmap covering technical challenges, capabilities and research mi...
Honeywell launches agentic AI platform for facility operations
Forge Cognition combines digital twins and AI agents to manage alarms, predict equipment issues and identify energy savings. The p...
HP introduces OmniBook 5 and ProBook 4 laptops
The laptops include OLED displays, NPU-based AI capabilities, USB-C connectivity and battery options for consumer and business use...
How Should Businesses Find Strategic Fit? Dirk Simon Weighs In — Part 2
In the first part of this story, we looked at how businesses can grow new businesses. Now we look deeper with Dirk Simon into how ...
Advanced Energy launches Centra Smart Hub for wafer temperature control
The system delivers up to 40% greater measurement accuracy at temperatures up to 1,700°C for silicon and silicon carbide processes...
NVIDIA and Cisco plan 400 Gb/s-per-lane USFP module
The OSFP-sized design targets up to 12.8 Tb/s of aggregate capacity with 16 full-duplex lanes for AI factory networks. The post NV...
Atomica launches MEMS optical control platform
Six reusable module families support micromirrors, microlenses, optical benches and wafer-level packaging for integrated optical d...
Epson launches SureColor F370 dye-sublimation printer
The new printer supports 13 × 19-inch media, while a cotton primer expands sublimation applications beyond polyester fabrics. The ...
Teledyne e2v launches Nexora CMOS image sensor family
Nexora offers 12 MP and 16 MP options with BSI pixels, 3D stacking, and LVDS connectivity for machine vision cameras. The post Tel...
Semtech enables 50G fronthaul for 5G-Advanced
The portfolio addresses rising uplink capacity needs driven by cloud-based AI, augmented reality and generative AI applications. T...
NovoLINC launches MaxLINC thermal interface material
MaxLINC targets heat flux above 100 W/cm² and accommodates up to 350 µm of device and package warpage. The post NovoLINC launches ...
Lawrence Semiconductor names Don Garrison as COO
Garrison brings 25 years of semiconductor manufacturing experience to support Lawrence’s capacity expansion. The post Lawrence Sem...