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Teledyne e2v launches Nexora CMOS image sensor family

Teledyne e2v launches Nexora CMOS image sensor family

Key Takeaways

  • Teledyne e2v’s Nexora family offers 12‑MP (4,096 × 3,072) and 16‑MP (4,096 × 4,096) backside‑illuminated (BSI) global‑shutter CMOS sensors.
  • Quantum efficiency reaches 73 % at 550 nm (visible) and 15 % at 940 nm (NIR), boosting performance in low‑light and near‑infrared scenarios.
  • 3‑D stacked architecture enables compact 23 × 21.5 mm packages, compatible with 29 × 29 mm² cameras and standard C‑mount optics.
  • LVDS I/O delivers high‑speed data transfer (up to 3 Gb/s per lane) while maintaining low power consumption (< 1.5 W).
  • Ideal for high‑resolution machine vision, intelligent traffic monitoring, and outdoor surveillance where speed and image fidelity are critical.

Introduction

Teledyne e2v has unveiled Nexora, a new line of BSI global‑shutter CMOS image sensors engineered for demanding machine‑vision workloads. The family targets applications that demand both high resolution and ultra‑fast frame rates while keeping power budgets modest.

Core Architecture

Backside‑Illuminated (BSI) Pixel Technology

Nexora’s proprietary BSI design places the photodiode directly beneath the metal wiring, maximizing the active‑area fill factor. Compared with traditional front‑side illuminated (FSI) devices, this geometry lifts quantum efficiency (QE) to 73 % at 550 nm (green) and 15 % at 940 nm (near‑infrared). The higher QE translates into superior signal‑to‑noise ratios in dim or mixed‑lighting environments.

3‑D Stacked Sensor Stack

The sensors employ a 3‑D stacked silicon‑on‑silicon approach, integrating the pixel array, analog front‑end, and digital processing layers in a compact multilayer stack. Benefits include:

Benefit Impact on Design
Reduced interconnect length Lower parasitic capacitance → higher readout speed
Integrated memory & DSP Enables on‑chip binning, HDR, and rolling‑shutter correction
Smaller footprint Fits into 23 × 21.5 mm package, compatible with 29 × 29 mm² camera modules

Product Variants

Variant Resolution (pixels) Pixel Pitch Max Frame Rate* Power (typ.) Color/Mono
Nexora‑12MP 4,096 × 3,072 3.2 µm 200 fps (full frame) 1.2 W Mono & Color
Nexora‑16MP 4,096 × 4,096 3.2 µm 150 fps (full frame) 1.5 W Mono & Color

*Frame rates are achievable with LVDS output configured for 8‑bit raw data; higher rates are possible with region‑of‑interest (ROI) readout.

Interface & Integration

  • LVDS I/O: Up to 3 Gb/s per lane, supporting standard FPGA and ISP platforms.
  • Package: 23 × 21.5 mm, 0.5 mm thickness, compatible with C‑mount lenses (1‑inch format).
  • Power Management: Dynamic voltage scaling reduces consumption during idle periods, extending the life of battery‑powered edge devices.

Target Applications

Application Why Nexora Fits
High‑Resolution Machine Vision 12–16 MP resolution with > 150 fps enables rapid defect detection on fast production lines.
Intelligent Traffic Systems Near‑infrared QE supports night‑time vehicle identification; low latency aids real‑time analytics.
Outdoor Surveillance BSI architecture maintains image quality under variable illumination; compact form factor eases enclosure design.

GEO (Search Engine) Optimization

The article incorporates high‑impact keywords such as CMOS image sensor, global shutter, machine vision, low power, backside illuminated, and Nexora. Headings (H2/H3) and bullet points improve readability for both users and search crawlers, while the comparison table supplies structured data that can be featured in rich snippets.

Bottom Line

Teledyne e2v’s Nexora sensors combine BSI pixel efficiency, 3‑D stacked integration, and a versatile LVDS interface to deliver 12‑MP and 16‑MP global‑shutter imaging at speeds exceeding 150 fps—all within a low‑power, compact package. For engineers building next‑generation machine‑vision, traffic‑monitoring, or surveillance systems, Nexora provides a compelling blend of resolution, speed, and sensitivity that outpaces conventional FSI CMOS options.

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