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1966 articles published
PCB Design Software in 2026: What Beginners Should Compare
For engineers, independent hardware developers, and technicians moving into professional hardware development, how you choose your...
Polymaker Releases HT-PLA Pro Filament for Better Performance & Thermal Stability
PLA became a favorite 3D printing material because people thought it was safer than ABS, since it didn’t give you headaches. And b...
Hadrian and Fortastra Bet on Automated Factories to Fix Satellite Production Bottlenecks
Demand for satellites continues to grow, and manufacturers are looking for ways to build spacecraft faster without affecting perfo...
Kalogon Wants to Patent Its Variable Density Wheelchair Cushion
Kalogon has brought the Verro to market. This is a 3D printed wheelchair cushion, made with vat polymerization technology. Using a...
Sinterit and DyeMansion Join Forces as Polymer LPBF Enters Its Next Competitive Phase
The entry-level laser powder bed fusion (LPBF) polymer space is heating up. Whereas in metals it’s Chinese vendors offering breakt...
ELEGOO launches H1 HT filament dryer
The dryer reaches 85°C and uses spool rotation, active vents and preset modes to manage moisture before FDM printing. The post ELE...
MULTIVAC selects Teamcenter as PLM backbone
The Siemens software will connect engineering data, CNC shopfloor operations and manufacturing resource management. The post MULTI...
AEWIN adds servers for AMD EPYC 9006 processors
The lineup includes 1U and 2U systems for AI, enterprise computing and NVMe storage with PCIe Gen6 support. The post AEWIN adds se...
ScaleFlux introduces PCIe Gen6 storage and memory controllers
FC6116 targets NVMe SSDs, while MC600 supports CXL 3.2 Type 3 memory expansion with DDR4 and DDR5. The post ScaleFlux introduces P...
ABB agrees to acquire Rotork for automation portfolio
The cash offer values Rotork at about $5.5 billion and is expected to close in the first half of 2027. The post ABB agrees to acqu...
SK Group and NVIDIA plan AI infrastructure partnership
The agreement includes a 2-GW AI cloud in Korea using NVIDIA DSX, Vera Rubin computing and SK hynix HBM4. The post SK Group and NV...
Aura, Leo, and Marie now available on 3DExperience
Dassault Systèmes’ three virtual companions are now online, plus more engineering software news. The post Aura, Leo, and Marie now...
Product Market Fit: Nikon Advanced Manufacturing CEO Hamid Zarringhalam on How Defense Demand is Pushing Metal AM to Scale
After years in which the additive manufacturing (AM) industry gained a reputation for its hype outpacing its performance, an inter...
IMDEA Materials & Lawrence Berkeley National Laboratory Work on Making 3D Printers Print in Unison
Spain’s IMDEA Materials Institute has worked with Lawrence Berkeley National Laboratory to detect and identify differences in diff...
Synopsys and NVIDIA advance agentic AI for chip design
The workflows use Nemotron, OpenShell and AgentEngineer for verification, AMS design and thermal analysis. The post Synopsys and N...
Why Kyle Bass Is Betting on Divergent, and What It Says About the Future of Manufacturing
Kyle Bass has spent much of his career looking at big economic trends before everyone else does. The founder of Hayman Capital Man...
PanOptimization Gets Attaboy from AFRL for PanX Software
Published in the International Journal of Advanced Manufacturing Technology, a paper titled “Part scale prediction of residual str...
Keysight RFPro gains Intel 14A and 18A-P certification
The certified EM software helps RFIC and mixed-signal teams validate simulations before chip production. The post Keysight RFPro g...
Siemens expands NVIDIA partnership for EDA AI workflows
Fuse EDA AI Agent adds Nemotron, OpenShell and CUDA-X support for verification, custom IC and PCB workflows. The post Siemens expa...
Synopsys adds agentic AI workflows for chip design
The Microsoft Discovery workflows target debug closure, root cause analysis and implementation QoR tuning. The post Synopsys adds ...
Amkor and NVIDIA expand advanced packaging capacity
The partnership covers high-density interconnects, heterogeneous integration and U.S. packaging and test expansion. The post Amkor...
Largest Funding Round to Date for AI-Powered 3D Image Generation: Meshy Closes Series B Worth Nearly $400M
Overall, the additive manufacturing (AM) industry has stayed impressively restrained in terms of trying to leverage any potential ...
AI is rewriting the enterprise software business model
Why the next phase of enterprise AI will be defined less by technology and more by governance, finance and strategy. The post AI i...
After the Hype: Conflux’s Dan Woodford on What It Takes to Scale Aerospace AM
A decade ago, Conflux Technology was founded around a simple idea: heat exchangers might be one of the best applications for metal...