Hexagon launches redesigned OPTIV S optical CMM

Key Takeaways

• Hexagon’s next‑gen OPTIV S optical CMM delivers E0 tactile accuracy of (1.6 + L/200) µm.
• Machine dynamics are up to 30 % faster thanks to higher travel speeds and acceleration.
• Early testing shows ≈15 % reduction in inspection cycle time versus the prior model.
• AI‑driven tools (Edge Detection, Fast Auto‑Focus, AI Illumination) will roll out in PC‑DMIS 2026.2–2027.
• The compact multisensor design consolidates optical, tactile, and hybrid inspections on a single platform.

Overview

Hexagon Manufacturing Intelligence has unveiled a redesigned version of its OPTIV S optical coordinate measuring machine (CMM). Targeted at high‑mix, low‑volume production of electronics, medical devices, automotive components, and precision engineering parts, the new system blends vision‑based metrology with tactile and multisensor options. Hexagon plans a phased software rollout through 2026‑2027, adding artificial‑intelligence (AI) assistance to streamline programming and reduce operator dependence.

Accuracy and Inspection Throughput

The refreshed OPTIV S focuses on tighter tolerances and faster part‑throughput:

Source: Hexagon Manufacturing Intelligence product brief, 2024.

The larger field of view enables the system to capture more geometric features per shot, cutting the number of required images and further accelerating cycle times. Combined with the higher dynamics, the machine meets the speed demands of production‑part inspection while preserving the sub‑micron accuracy required for precision engineering.

AI‑Assisted Measurement Functions

Hexagon is embedding three AI‑powered modules into PC‑DMIS, the industry‑standard metrology software:

These tools aim to standardize optical setups across different machines and part conditions, reducing human‑induced variability and improving repeatability.

Multisensor Inspection Platform

The new OPTIV S remains a compact, three‑axis CMM (≈1.2 m × 0.9 m × 1.5 m) but now houses a unified sensor suite:

• Optical head: High‑resolution camera (up to 12 MP) with interchangeable lenses.
• Tactile probe: Scanning probe with a 0.1 mm tip radius, compatible with ISO 10360‑2 standards.
• Hybrid mode: Simultaneous optical‑tactile data capture for complex free‑form geometries.

This integration eliminates the need for separate optical and tactile stations, freeing floor space and simplifying calibration procedures.

Bottom Line

Hexagon’s redesigned OPTIV S positions itself as a high‑accuracy, high‑throughput optical CMM that bridges the gap between pure vision systems and traditional tactile machines. With 30 % faster dynamics, 15 % shorter cycle times, and AI‑enhanced programming, the platform promises measurable productivity gains for industries where precision and speed are non‑negotiable. The phased software releases through 2027 will further future‑proof the system, making the OPTIV S a compelling investment for manufacturers seeking a versatile, single‑footprint inspection solution.