Technology
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binder introduces angled M12 connectors for tubular sensors
The connectors support centered PCB mounting, four- and five-pin interfaces and operating temperatures from -40°C to +85°C. The po...
NVIDIA expands CUDA-Q platform with CUDA-Q Logical
The orchestration layer helps researchers evaluate fault-tolerant quantum system configurations and resource requirements. The pos...
Morgan State partners with Google on AI research campus
The collaboration provides GPU computing for research in AI, cybersecurity, climate science and health sciences. The post Morgan S...
CAE and WB Electronics sign MoU on unmanned systems
CAE and WB Electronics announced the signing of a Memorandum of Understanding (MoU) at MSPO 2026. The agreement marks an important...
SKF partners with Sentea on integrated sensing platform
The SKF Core platform combines sensing, processing and communication to simplify deployment of machine intelligence at scale. The ...
Quantinuum and Aramco explore quantum computing collaboration
The companies will assess energy-sector applications, compare quantum approaches and exchange technical expertise under a non-bind...
SEMI and Silicon Catalyst form global startup partnership
The collaboration will connect semiconductor startups with investors, manufacturers and technology leaders through SEMICON events....
SunCubes uses AI simulation to develop UAV charging systems
SimScale tools support thermal, structural and aerodynamic analysis of wireless energy-transfer hardware. The post SunCubes uses A...
Bosch Power Tools launches two professional metalworking tools
The new tools include a 10.5-kg magnetic core drill and a cordless right-angle impact wrench with 330 Nm of torque. The post Bosch...
Atomica launches AI Photonic Integration Platform
The platform combines microfabrication technologies to integrate optical, electronic, memory and thermal components in AI hardware...
Vishay adds 650 W thick film power resistor series
RPWA 650 devices offer optional temperature sensing, customizable cabling and resistance values from 6.2 Ω to 1 MΩ. The post Visha...
Pace Wireless joins Morse Micro design partner program
The program supports Wi-Fi HaLow product development with silicon access, tools and engineering support. The post Pace Wireless jo...