Technology
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Cadence, Intel expand DTCO work for Intel 14A
The multiyear agreement covers production-ready PDKs, agentic AI design flows and Design IP for next-generation process nodes. The...
Sony readies X-ray CMOS sensor for high-speed imaging
The IMX711 targets inspection and measurement systems with photon-energy detection, 34 e-rms noise and FY2026 shipment plans. The ...
MediaTek helps power NVIDIA RTX Spark PCs
The SoC supports up to 128GB unified memory, ultra-low-latency wireless and is set to appear in laptops in fall 2026. The post Med...
Made By Makers In The Heart of Campania
The inaugural Maker Faire Caserta gets right to the point with its opening statement: The Made in Italy Core of Innovation and Dig...
GIGABYTE wins COMPUTEX 2026 awards for AI hardware
Recognized products include a motherboard, eGPU and laptop built for local AI workloads, graphics and thermal management. The post...
Mitsubishi Electric engineer earns Kaggle master title
Tadakiyo Seki ranked in the top 1.3% of participants with one gold and two silver medals in AI competitions. The post Mitsubishi E...
FARO CREAFORM HandySCAN 3D EVO wins Red Dot design award
The handheld scanner has a 4.3-inch touchscreen, three mechanical buttons and a single industrial push-pull connector. The post FA...
Dell launches local agentic AI systems for workgroups
The platform supports deskside-to-server deployment and can reduce AI spending by up to 87% over two years. The post Dell launches...
Emerson updates AspenTech Inmation OT Data Fabric
Release adds distributed node architecture and edge-to-cloud support across Windows and Linux environments. The post Emerson updat...
Lightium chooses Aras to streamline photonic chip development
Its light-based chips cut energy use by over 30% and aim to push data speeds beyond 6 Tbit/s in the coming years. The post Lightiu...
Titomic Lands at Iowa State: Cold Spray Moves Further into Research and Industry
Charles R. Goulding and Preeti Sulibhavi take a closer look at Titomic’s growing academic footprint and what its new Iowa State pa...
DYPIU and Dassault to open engineering experience center
The facility will include labs for product innovation, virtual twin simulation and smart manufacturing training. The post DYPIU an...