Key Takeaways

• Hexagon’s new OPTIV S optical CMM delivers E0 tactile accuracy of (1.6 + L/200) µm.
• Machine dynamics are up to 30 % faster thanks to higher travel speeds and acceleration.
• Initial field trials show ~15 % reduction in inspection cycle time.
• AI‑driven tools (edge detection, auto‑focus, illumination) will roll out in 2026‑2027 to cut programming effort and improve repeatability.
• The compact multisensor design replaces separate tactile‑only or vision‑only stations, supporting electronics, medical, automotive, and precision‑engineering parts.

Hexagon Unveils the Redesigned OPTIV S Optical Coordinate Measuring Machine

Hexagon Manufacturing Intelligence has introduced the next‑generation OPTIV S, an optical CMM that blends high‑precision tactile probing with advanced vision measurement. The platform is built for the inspection of intricate parts found in electronics, medical devices, automotive systems, and other high‑precision sectors. A phased software rollout is planned for 2026 and 2027, adding AI‑assisted measurement capabilities.

Accuracy and Throughput Enhancements

The refreshed OPTIV S targets faster, more reliable inspections without sacrificing the tight tolerances demanded by modern manufacturing.

• Tactile accuracy follows the E0 standard, with a maximum positional error of (1.6 + L/200) µm, where L is the probe length in millimetres.
• Machine dynamics have been boosted by roughly 30 %, allowing the carriage to reach higher speeds and accelerations, which translates into shorter part‑to‑part movements.
• Early testing on production‑part samples recorded ≈15 % faster cycle times, a direct benefit for high‑volume environments.
• An expanded field of view captures more features per image, reducing the number of required captures and simplifying data handling.

These upgrades make the OPTIV S suitable for both production‑part inspection and high‑precision verification, bridging the gap between speed and accuracy.

AI‑Assisted Measurement Functions

Integrated into Hexagon’s PC‑DMIS software, the AI suite will be released in stages:

These tools aim to standardise optical measurements across different machines and part conditions, minimising operator‑induced variance and improving repeatability.

Multisensor Inspection Platform

The OPTIV S is engineered as a compact, all‑in‑one multisensor CMM. Its mechanical redesign and upcoming AI software eliminate the need for separate tactile‑only or vision‑only stations, offering:

• Optical measurement for non‑contact inspection of delicate surfaces.
• Tactile probing for critical dimensions where contact is required.
• Hybrid modes that combine both data sets for comprehensive part analysis.

This flexibility supports a wide range of inspection strategies—from single‑point probing on medical implants to full‑field imaging of printed circuit boards—while occupying a smaller footprint on the shop floor.

Bottom Line

Hexagon’s revamped OPTIV S positions itself as a high‑performance, AI‑enhanced optical CMM that does not compromise on the stringent accuracy levels demanded by precision industries. With 30 % faster dynamics, 15 % shorter cycle times, and a suite of AI tools slated for release through 2027, the system promises to streamline inspection workflows, reduce programming effort, and deliver consistent results across diverse part geometries. For manufacturers seeking a single, versatile platform that can handle both tactile and vision‑based measurements, the OPTIV S represents a compelling upgrade over legacy CMM solutions.