Key Takeaways
- Mitsubishi Electric Corporation and Semikron Danfoss Elektronik GmbH & Co. KG have jointly developed a new standard package for power modules with integrated 3-level circuits
- The new package is designed for industrial drive equipment and renewable energy systems
- It is based on Mitsubishi Electric's LV100-type package and Semikron Danfoss's SEMITRANS20 package
- The package optimizes terminal layout and functions for 3-level circuits and ensures compatibility between the two companies' products
Introduction to 3-Level Power Module Packages
Mitsubishi Electric Corporation and Semikron Danfoss Elektronik GmbH & Co. KG have collaborated to develop a new standard package for power modules with integrated 3-level circuits. This package is designed to target inverter designs for industrial drive equipment and renewable energy systems. The movement towards a decarbonized society, also known as Green Transformation (GX), has led to an increased demand for power semiconductors that efficiently convert electricity.
Benefits of 3-Level Circuits
3-level circuits offer higher efficiency and allow for smaller peripheral components compared to conventional 2-level circuits. The new package incorporates a 3-level T-type circuit, which contributes to higher efficiency and more compact inverter designs. The optimal arrangement of main electrode terminals and auxiliary control terminals specifically for 3-level T-type circuits enhances inverter design flexibility.
Comparison of Package Types
| Package Type | Description | Benefits |
|---|---|---|
| LV100-type | Mitsubishi Electric's package for high-power applications | High power density, compact design |
| SEMITRANS20 | Semikron Danfoss's package for power semiconductors | High reliability, low losses |
| New Standard Package | Jointly developed package with integrated 3-level circuits | Higher efficiency, more compact design, enhanced design flexibility |
Future Developments
Both companies will independently develop products using this new standard package, contributing to standardized inverter designs. The package concept is scheduled to be exhibited at the Power Conversion Intelligent Motion (PCIM) Expo & Conference 2026 in Nuremberg, Germany, as well as upcoming exhibitions in Japan, China, and other countries.
Technical Specifications
The new package has a maximum operating temperature of 150°C and a maximum operating voltage of 1200V. It is designed to meet the requirements of industrial drive equipment and renewable energy systems, with a focus on high efficiency and compact design.
Bottom Line
The jointly developed standard package for power modules with integrated 3-level circuits by Mitsubishi Electric Corporation and Semikron Danfoss Elektronik GmbH & Co. KG is a significant development in the field of power semiconductors. With its higher efficiency, more compact design, and enhanced design flexibility, this package is expected to contribute to the growth of the industrial drive equipment and renewable energy systems markets, ultimately supporting the transition to a decarbonized society.