Key Takeaways
- Keysight’s Advanced Design System (ADS) Photonic Designer now natively supports Tower Semiconductor’s PH18 silicon‑photonic PDK.
- Designers can create, simulate, and layout photonic‑integrated circuits (PICs) and co‑design them with RF/electronic blocks in a single environment.
- The integrated flow eliminates costly data‑hand‑off, reduces model‑translation errors, and speeds up verification for optical link rates ≥ 1.6 Tb/s.
- ADS delivers DRC‑compliant layout, LVS checks, and physics‑based component models, while final tape‑out still uses Tower’s own verification suite.
Why a Unified Photonic‑Electronic Design Flow Matters
Growing Bandwidth Demands
Modern data‑center and telecom links are pushing 1600 Gb/s (1.6 Tb/s) and higher per wavelength. At these speeds, the interaction between electrical interconnects and optical waveguides becomes a dominant performance factor. Traditional design cycles split the work:
| Stage | Typical Tool | Primary Output | Pain Points |
|---|---|---|---|
| Electrical circuit design | RF circuit simulators (e.g., Keysight ADS, Cadence) | S‑parameters, transient response | No optical view |
| Photonic layout & verification | Photonic‑specific tools (e.g., Lumerical, Synopsys RSoft) | GDSII, optical mode data | No direct access to electronic models |
| System‑level verification | Separate co‑simulation platforms (e.g., MATLAB/Simulink) | System‑level eye diagrams | Manual model translation, risk of mismatches |
The split workflow forces engineers to export netlists, re‑format S‑parameters, and rebuild models, which adds weeks of effort and introduces error sources.
ADS + Tower PH18: One‑Stop Shop
By embedding Tower’s PH18 PDK into ADS Photonic Designer, the same schematic can host:
- Electrical blocks (e.g., SiGe power amplifiers, RF front‑ends)
- Photonic components (e.g., waveguides, grating couplers, modulators)
All elements share a common simulation kernel, enabling electrical‑optical‑electrical (EOE) co‑simulation that predicts insertion loss, chirp, and bandwidth under realistic drive conditions.
Features Delivered by the Integrated Flow
Physics‑Based Component Models
The PH18 PDK supplies parameterized models for:
| Component | Key Parameters | Typical Spec |
|---|---|---|
| Silicon waveguide (0.18 µm) | Width 450 nm, loss 0.6 dB/cm | Propagation loss ≤ 0.6 dB/cm |
| Mach‑Zehnder modulator | Vπ·L ≈ 1.2 V·cm, bandwidth 30 GHz | 3 dB BW ≥ 30 GHz |
| Grating coupler | Coupling efficiency 45 % @ 1550 nm | Insertion loss ≈ 3.5 dB |
These models are temperature‑aware and can be linked directly into ADS’s RFPro EM solver for accurate electro‑thermal analysis.
Layout Automation & Verification
- DRC‑compliant photonic layout primitives generated from the PDK ensure that mask‑level rules (minimum bend radius 5 µm, spacing ≥ 2 µm) are respected automatically.
- LVS (Layout‑Versus‑Schematic) checks verify that the physical implementation matches the intended circuit topology, catching mismatches before tape‑out.
Seamless Transition to Foundry Tape‑out
While ADS handles the design‑to‑verification loop, Tower’s own process‑specific verification suite finalizes mask data preparation (MDP) and design‑for‑manufacturing (DFM) checks. This dual‑tool approach preserves foundry compliance without sacrificing the integrated design experience.
Real‑World Impact
- Design cycle reduction: Early reports from pilot teams show 30‑40 % faster time‑to‑simulation compared with legacy multi‑tool flows.
- Error mitigation: Co‑simulation eliminates up to 90 % of model‑translation discrepancies, as measured by post‑tape‑out performance drift.
- Scalability: The same workflow scales from single‑channel transceivers to dense wavelength‑division multiplexing (DWDM) modules with > 80 channels per chip.
Bottom Line
Keysight’s ADS Photonic Designer now fully supports Tower Semiconductor’s PH18 silicon‑photonic PDK, delivering a single‑environment workflow that bridges high‑speed RF/electronic design with state‑of‑the‑art photonic integration. Engineers can simulate, layout, and verify PICs alongside electronic circuits, cutting design time, reducing errors, and preparing chips for the 1.6 Tb/s optical links that will power next‑generation data infrastructure. The solution is available immediately; further details are on keysight.com.