Key Takeaways
- Keysight’in Advanced Design System (ADS) Photonic Designer artık Tower Semiconductor’in PH18 silicon-photonic PDK’sını yerel olarak destekliyor.
- Tasarımcılar, fotonik-entegre devreleri (PIC) ve bunları tek bir ortamda RF/electronic bloklarıyla birlikte tasarlayabilir.
- Entegre akış, maliyetli veri-devirini ortadan kaldırır, model-çeviri hatalarını azaltır ve optik bağlantı hızları ≥ 1.6 Tb/s için doğrulamayı hızlandırır.
- ADS, DRC-uyumlu yerleşim, LVS kontrolleri ve fizik-tabanlı bileşen modelleri sunarken, nihai tape-out hâlâ Tower’ın kendi doğrulama paketini kullanır.
Why a Unified Photonic-Electronic Design Flow Matters
Growing Bandwidth Demands
Modern veri-merkezi ve telekom bağlantıları 1600 Gb/s (1.6 Tb/s) ve daha yüksek hızları dalga boyu başına itiyor. Bu hızlarda, elektriksel interconnectler ile optik dalga kılavuzları arasındaki etkileşim belirleyici bir performans faktörü haline geliyor. Geleneksel tasarım döngüleri işi bölüyor:
| Stage | Typical Tool | Primary Output | Pain Points |
|---|---|---|---|
| Electrical circuit design | RF circuit simulators (e.g., Keysight ADS, Cadence) | S-parameters, transient response | No optical view |
| Photonic layout & verification | Photonic-specific tools (e.g., Lumerical, Synopsys RSoft) | GDSII, optical mode data | No direct access to electronic models |
| System-level verification | Separate co-simulation platforms (e.g., MATLAB/Simulink) | System-level eye diagrams | Manual model translation, risk of mismatches |
The split workflow forces engineers to export netlists, re-format S-parameters, and rebuild models, which adds weeks of effort and introduces error sources.
ADS + Tower PH18: One-Stop Shop
By embedding Tower’s PH18 PDK into ADS Photonic Designer, the same schematic can host:
- Electrical blocks (e.g., SiGe power amplifiers, RF front-ends)
- Photonic components (e.g., waveguides, grating couplers, modulators)
All elements share a common simulation kernel, enabling electrical-optical-electrical (EOE) co-simulation that predicts insertion loss, chirp, and bandwidth under realistic drive conditions.
Features Delivered by the Integrated Flow
Physics-Based Component Models
The PH18 PDK supplies parameterized models for:
| Component | Key Parameters | Typical Spec |
|---|---|---|
| Silicon waveguide (0.18 µm) | Width 450 nm, loss 0.6 dB/cm | Propagation loss ≤ 0.6 dB/cm |
| Mach-Zehnder modulator | Vπ·L ≈ 1.2 V·cm, bandwidth 30 GHz | 3 dB BW ≥ 30 GHz |
| Grating coupler | Coupling efficiency 45 % @ 1550 nm | Insertion loss ≈ 3.5 dB |
These models are temperature-aware and can be linked directly into ADS’s RFPro EM solver for accurate electro-thermal analysis.
Layout Automation & Verification
- DRC-compliant photonic layout primitives generated from the PDK ensure that mask-level rules (minimum bend radius 5 µm, spacing ≥ 2 µm) are respected automatically.
- LVS (Layout-Versus-Schematic) checks verify that the physical implementation matches the intended circuit topology, catching mismatches before tape-out.
Seamless Transition to Foundry Tape-out
While ADS handles the design-to-verification loop, Tower’s own process-specific verification suite finalizes mask data preparation (MDP) and design-for-manufacturing (DFM) checks. This dual-tool approach preserves foundry compliance without sacrificing the integrated design experience.
Real-World Impact
- Design cycle reduction: Early reports from pilot teams show 30-40 % faster time-to-simulation compared with legacy multi-tool flows.
- Error mitigation: Co-simulation eliminates up to 90 % of model-translation discrepancies, as measured by post-tape-out performance drift.
- Scalability: The same workflow scales from single-channel transceivers to dense wavelength-division multiplexing (DWDM) modules with > 80 channels per chip.
Bottom Line
Keysight’s ADS Photonic Designer now fully supports Tower Semiconductor’s PH18 silicon-photonic PDK, delivering a single-environment workflow that bridges high-speed RF/electronic design with state-of-the-art photonic integration. Engineers can simulate, layout, and verify PICs alongside electronic circuits, cutting design time, reducing errors, and preparing chips for the 1.6 Tb/s optical links that will power next-generation data infrastructure. The solution is available immediately; further details are on keysight.com.