ACCM expands US capacity for Celeritas dielectric materials

Key Takeaways

• ACCM will add 20 M sq ft/yr of Celeritas laminate capacity (Jan 2027) and 87 M sq ft/yr of prepreg & build‑up capacity (Nov 2026).
• All new lines are U.S.–based, use a raw‑material feed that is independent of traditional copper‑clad laminates, and promise ~3‑week lead times.
• The expansion introduces five Celeritas grades—SF1600, HM001, HM50, SMC, BU++—each engineered for a specific AI‑hardware bottleneck (speed, thermal‑expansion control, warpage, silicon‑match).
• Materials are halogen‑free, PFAS‑free, and free of T‑glass or quartz fabric, yet compatible with existing lamination, drilling and plating equipment.
• A second‑generation materials‑characterization lab opens in La Crosse, WI (Oct 2026) to accelerate qualification and reliability testing.

Overview

Advanced Chip and Circuit Materials, Inc. (ACCM) announced a strategic scale‑up of its U.S. manufacturing footprint for the Celeritas family of high‑performance dielectric laminates. The move targets the four critical segments of AI hardware where material limitations presently dictate system architecture: ultra‑high‑speed, skew‑free interconnects; low‑ and negative‑expansion substrates for large accelerator boards; IC‑package core materials; and low‑loss build‑up films.

New Production Capacity

All facilities are located in the United States, leveraging a raw‑material supply chain that bypasses the conventional copper‑clad laminate market. This independence enables typical order‑to‑ship cycles of three weeks, a significant reduction versus the industry norm of 6–8 weeks.

Celeritas Material Portfolio

Material Families

All five grades are halogen‑free, PFAS‑free, and free of T‑glass or quartz fabric, allowing them to be processed on the same lamination, drilling, and plating equipment used for legacy materials.

Materials Characterization Laboratory

A second‑generation materials‑characterization lab will become operational at ACCM’s La Crosse, Wisconsin campus in October 2026. The facility will provide:

• High‑frequency dielectric loss measurements up to 40 GHz.
• Thermal‑expansion and warpage analysis under accelerated temperature cycling.
• Reliability testing aligned with JEDEC and IPC standards.

This lab shortens the qualification loop for new Celeritas grades, supporting rapid adoption in next‑generation AI hardware.

Supply‑Chain and Environmental Advantages

• Domestic sourcing eliminates cross‑border logistics and tariff exposure.
• Three‑week lead times improve design‑to‑production velocity for OEMs.
• Environmental compliance: halogen‑free, PFAS‑free formulations meet RoHS and REACH requirements without sacrificing performance.

Bottom Line

ACCM’s capacity expansion positions the United States as a self‑sufficient hub for ultra‑high‑performance dielectric laminates, directly addressing the material bottlenecks that constrain AI and high‑speed computing architectures. With over 100 M sq ft/yr of new laminate and prepreg capability, a dedicated characterization lab, and a portfolio of environmentally responsible, equipment‑compatible materials, ACCM is set to accelerate time