Artikel — Seite 18
View All →Siemens expands NVIDIA partnership for EDA AI workflows
Fuse EDA AI Agent adds Nemotron, OpenShell and CUDA-X support for verification, custom IC and PCB workflows. T...
Synopsys adds agentic AI workflows for chip design
The Microsoft Discovery workflows target debug closure, root cause analysis and implementation QoR tuning. The...
Amkor and NVIDIA expand advanced packaging capacity
The partnership covers high-density interconnects, heterogeneous integration and U.S. packaging and test expan...
Largest Funding Round to Date for AI-Powered 3D Image Generation: Meshy Closes Series B Worth Nearly $400M
Overall, the additive manufacturing (AM) industry has stayed impressively restrained in terms of trying to lev...
AI is rewriting the enterprise software business model
Why the next phase of enterprise AI will be defined less by technology and more by governance, finance and str...
After the Hype: Conflux’s Dan Woodford on What It Takes to Scale Aerospace AM
A decade ago, Conflux Technology was founded around a simple idea: heat exchangers might be one of the best ap...
3DPOD 308: Engineering Design with Matthew Shomper, Not a Robot and F13LD
Matthew Shomper has worked on 3D printed medical devices for many years. There, he specialized in new geometri...
NVIDIA expands Agent Toolkit for engineering workflows
NVIDIA adds PhysicsNeMo and CUDA-X libraries to support AI agents for simulation, RTL coding and quantum chemi...
Supermicro adds H15 servers with AMD EPYC 9006 CPUs
The portfolio supports up to 256 cores, 512 threads, expanded memory bandwidth and AI, cloud, storage and HPC ...
NVIDIA and KAIST open agentic AI research lab in Seoul
The five-year collaboration includes compute contributions and funding for at least 10 KAIST researchers each ...
BOSGAME mini PC adds Intel Core 3 processor 304
The E6 ECO supports Wi-Fi 7, Bluetooth 5.4, triple displays and up to 24 TOPS of combined AI performance. The ...
MulticoreWare advances physical AI on AMD platforms
The collaboration shows VLA models running on Ryzen AI Embedded GPUs using ROCm for real-time robot perception...
Nemetschek India and Novatr partner on BIM training
The program integrates Archicad, Allplan, Bluebeam, Solibri and Vectorworks into project-based learning paths....
Siemens and HD Hyundai plan digital shipyard model
The agreement uses Siemens Xcelerator to connect ship design, engineering, manufacturing and lifecycle managem...
ARBOR launches COM-HPC module with AMD Ryzen AI Embedded
The COMX-C710 delivers up to 126 TOPS of AI performance with CPU, GPU and NPU workload distribution for edge s...
ASUS adds AMD EPYC 9006 servers for enterprise workloads
The new dual- and single-socket systems support PCIe 6.0, MRDIMM memory and high-density E3.S storage. The pos...
Bambu Lab and Insta360 Invite Makers to Build Custom Camera Gear
Bambu Lab is expanding the role of MakerWorld, its community platform for 3D printable models. The company has...
congatec adds COM-HPC module for physical AI systems
The conga-HPC/cRX1 supports up to 16 Zen 5 cores, 50 TOPS NPU performance and -40°C to +85°C operation. The po...