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Synopsys expands AI EDA and IP support for TSMC nodes

Synopsys expands AI EDA and IP support for TSMC nodes

Key Takeaways

  • Synopsys, Inc. has expanded its AI EDA and IP support for TSMC nodes, including the 3nm and 2nm families
  • The company has unified intelligent digital, analog, and verification flows to improve quality of multiphysics results
  • Synopsys' 3DIC Compiler integrates with RedHawk-SC, RedHawk-SC Electrothermal, and Ansys HFSS for multiphysics analysis
  • The collaboration enables designs using TSMC's 3DFabric technologies with automation capabilities for productivity gains

Introduction to Synopsys' AI EDA and IP Support

Synopsys, Inc. has announced significant advancements in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes. This expansion includes support for the TSMC 3nm and 2nm families, as well as A16 with Super Power Rail and A14.

Advancing 3DFabric with Integrated Analysis and Signoff Flows

To support the growing scale and complexity of multi-die designs, Synopsys and TSMC have enhanced enablement across TSMC's 3DFabric technologies, including TSMC-SoIC and CoWoS for 5.5x reticle interposer sizes. Synopsys' 3DIC Compiler, a unified exploration-to-signoff platform, enables designs using TSMC's 3DFabric technologies with automation capabilities for productivity gains.

Comparison of Synopsys' 3DIC Compiler with Other Tools

Tool Features Benefits
Synopsys' 3DIC Compiler Unified exploration-to-signoff platform, integrates with RedHawk-SC, RedHawk-SC Electrothermal, and Ansys HFSS Improved quality of multiphysics results, accelerated development cycles
RedHawk-SC Digital power integrity analysis Enhanced power integrity and signal integrity analysis
RedHawk-SC Electrothermal Electrothermal analysis Improved thermal and power management
Ansys HFSS High-speed signal integrity analysis Enhanced signal integrity and electromagnetic analysis

Collaboration and Integration

Synopsys' 3DIC Compiler integrates with RedHawk-SC, RedHawk-SC Electrothermal, and Ansys HFSS to deliver multiphysics analysis for thermal, power, and high-speed signal integrity. This collaboration enables designers to improve the quality of multiphysics results and accelerate development cycles from silicon to systems for increasingly complex AI and high-performance computing designs.

Bottom Line

In conclusion, Synopsys' expansion of AI EDA and IP support for TSMC nodes, including the 3nm and 2nm families, enables designers to improve the quality of multiphysics results and accelerate development cycles. The company's unified intelligent digital, analog, and verification flows, combined with its 3DIC Compiler and collaboration with other tools, provide a comprehensive solution for complex AI and high-performance computing designs. With its advanced features and benefits, Synopsys' solution is poised to revolutionize the field of electronics design and manufacturing.

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