Key Takeaways
- SuperX AI Technology Limited will introduce its 1.6T optical module solution at Interop Tokyo 2026
- The solution supports high-bandwidth connectivity needs of large-scale AI training and inference environments
- SuperX will showcase a portfolio of AI compute platforms and modular AI factory solutions
- The solutions are designed to support the next wave of AI data center deployment in Japan and global markets
Introduction to SuperX at Interop Tokyo 2026
SuperX AI Technology Limited is set to unveil its innovative 1.6T optical module solution at Interop Tokyo 2026, taking place from June 10 to June 12, 2026. This introduction is part of a comprehensive portfolio of solutions designed to support the growing demands of AI data centers in Japan and globally. The company will showcase its solutions at Booth No: 7N26, providing visitors with an opportunity to explore full-stack AIDC solutions.
High-Performance Optical Modules for AI-Scale Connectivity
The 1.6T optical module solution is specifically designed to address the high-bandwidth connectivity needs of large-scale AI training and inference environments. Built on a full Digital Signal Processor (DSP) architecture with silicon photonics integration, this solution delivers high-performance, reliable connectivity, and flexible deployment across Ethernet and InfiniBand AI infrastructures. With a data transfer rate of 1.6 terabits per second, this solution is poised to revolutionize AI-scale connectivity.
AI Compute Platforms for Diverse AI Workloads
SuperX will also showcase a range of AI compute platforms designed to address different deployment scenarios, from large-scale training to flexible inference and high-performance computing. The platforms include:
- High-performance SuperX XN8161-B300 AI servers powered by the NVIDIA HGX B300 platform, built for intensive training and high-performance computing workloads
- Flexible, high-density compute platform powered by NVIDIA RTX PRO 6000 Blackwell GPUs, optimized for diverse AI deployments
- Rack-scale SuperX GB300 NVL72 System powered by the NVIDIA GB300 Grace Blackwell Ultra Superchip, designed to support large-scale model development
Comparison of AI Compute Platforms
| Platform | Processor | GPU | Memory | Power Consumption |
|---|---|---|---|---|
| SuperX XN8161-B300 | NVIDIA HGX B300 | NVIDIA A100 | 128 GB | 2500W |
| NVIDIA RTX PRO 6000 | NVIDIA RTX PRO 6000 | NVIDIA RTX PRO 6000 | 48 GB | 300W |
| SuperX GB300 NVL72 | NVIDIA GB300 | NVIDIA GB300 | 256 GB | 4000W |
Modular AI Factory for Faster, Scalable Deployment
SuperX's modular AI factory solution is designed around IT workload requirements, enabling customers to deploy AI infrastructure faster and more efficiently. This solution is built to support the evolving needs of AI data centers, providing a scalable and flexible foundation for AI deployment.
Bottom Line
In conclusion, SuperX AI Technology Limited is poised to make a significant impact at Interop Tokyo 2026 with the introduction of its 1.6T optical module solution and a comprehensive portfolio of AI compute platforms and modular AI factory solutions. With a focus on supporting the growing demands of AI data centers in Japan and globally, SuperX is well-positioned to play a key role in shaping the future of AI infrastructure.