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Hi3D to launch V3.0 with 48-hour free access

Hi3D to launch V3.0 with 48-hour free access

Hi3D will launch V3.0 on August 19, 2026, with free access to the new model for its first 48 hours on the Hi3D platform. Hi3D V3.0 reaches 2048³ voxel resolution and is designed to preserve fine detail across several 3D creation use cases.

Higher precision for AI 3D modeling

Hi3D V1.0 was commercially available at 1536³ voxel resolution. Hi3D V3.0 increases that to 2048³ voxel resolution, providing a higher resolution option for AI-generated 3D models.

Precision is a key update, along with broader improvements across the 3D creation pipeline. Hi3D V3.0 is designed to support closer inspection of generated models and improve results across multiple stages of the workflow.

In addition to the updates above, Hi3D offers:

  • 3D Model Maker: An AI 3D creation platform that brings image-to-3D generation, AI texturing, model splitting and multi-format export into one workspace.
  • Image to 3D Model: Turns a 2D reference image into a structured 3D model for games, design, art or 3D printing.
  • AI Texturing: Generates textures for untextured 3D models.
  • Split for 3D Printing: Splits complete models into printable parts and adds connectors for printing and assembly.
  • Multicolor 3D Printing: Converts textured models into separated color regions and prepares them for compatible multicolor printing workflows.

Free access period

Hi3D said its platform is based on making AI 3D modeling accessible to users across different industries and experience levels. 3D printing, games, film, e-commerce, industrial design, jewelry and other fields use 3D assets, and Hi3D aims to reduce the barrier to creating them. The company is opening V3.0 for 48 hours so users can evaluate the model and see how it fits into their existing workflows.

48-hour free access

When: August 19, 2026 (00:00 UTC) – August 20, 2026 (24:00 UTC)
Website: Hi3D
Terms: Full access to Hi3D V3.0

The post Hi3D to launch V3.0 with 48-hour free access appeared first on Engineering.com.

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