congatec adds COM-HPC module for physical AI systems

Key Takeaways

• congatec introduces the aReady.COM conga-HPC/cRX1, a COM-HPC Client Size C module based on AMD Ryzen AI Embedded X100 Series processors
• The module supports up to 16 AMD "Zen 5" CPU cores, up to 40 compute units of integrated AMD Radeon RDNA 3.5 graphics, and a dedicated NPU
• It provides integrated AI and FP32 compute capability for applications that may otherwise require a discrete AI accelerator
• The module is designed for compute-intensive physical AI applications, including robotics, autonomous commercial vehicles, medical technology, and industrial automation

Introduction to COM-HPC Module

congatec has launched the aReady.COM conga-HPC/cRX1, a COM-HPC Client Size C module designed for compute-intensive physical AI applications. The module is based on AMD Ryzen AI Embedded X100 Series processors, which provide up to 16 "Zen 5" CPU cores, up to 40 compute units of integrated AMD Radeon RDNA 3.5 graphics, and a dedicated NPU.

Features and Specifications

The conga-HPC/cRX1 module supports industrial operating temperatures from -40°C to +85°C and is intended for systems that combine perception, decision-making, and actuation. The module's key features include:

• Up to 16 AMD "Zen 5" CPU cores with clock frequencies up to 5.1 GHz
• Up to 40 compute units of integrated AMD Radeon RDNA 3.5 graphics
• Dedicated NPU with up to 50 TOPS of AI performance
• Up to 128 GB of LPDDR5X-8533 unified memory
• Optional on-board NVMe storage up to 512 GB
• Up to 24 PCIe Gen4 lanes for expansion

Comparison of COM-HPC Modules

Applications and Use Cases

The conga-HPC/cRX1 module is designed for a range of applications, including:

• Robotics
• Autonomous commercial vehicles for farming, logistics, and forestry
• Medical technology
• Industrial automation

Bottom Line

The congatec aReady.COM conga-HPC/cRX1 module is a powerful solution for compute-intensive physical AI applications. With its integrated AI and FP32 compute capability, the module provides a high-performance solution for applications that may otherwise require a discrete AI accelerator. Its support for industrial operating temperatures and modular design make it an ideal choice for a range of applications, from robotics to industrial automation.